Abierta Convocatoria ECSEL JU de financiación de proyectos (convocatoria), en la que participa la Agencia junto con el Ministerio de AAEE y TD (MINAETD). La convocatoria cierra el próximo 5 de mayo de 2020.  Cubre un rango muy amplio de áreas (se pueden ver más adelante) y tiene gran relevancia internacional con 28 países participantes.

 

La financiación proviene, por una parte, de la empresa común ECSEL JU (154M€), y por otra, de la Agencia Estatal de Investigación (AEI, 1,3M€) y del Ministerio de Asuntos Económicos y Transformación Digital (MINAETD, 10M€), que financian directamente a centros de investigación, centros tecnológicos y empresas españoles.

ECSEL Joint Undertaking (https://www.ecsel.eu/) es una empresa común público-privada  que financia investigación, desarrollo e innovación en Sistemas y Componentes Electrónicos (ECS) como tecnologías clave para la era de la economía digital y de acuerdo a la normativa que lo estableció (COUNCIL REGULATION (EU) No 561/2014 of 6 May 2014 establishing the ECSEL Joint Undertaking).

Asociaciones industriales, estados miembros y la Comisión Europea forman ECSEL JU.  ECSEL JU financia proyectos de investigación, desarrollo e innovación que incluyen ECS a través de convocatorias anuales de proyectos transnacionales.

 

Se encuentra abierta la convocatoria 2020 (https://www.ecsel.eu/calls/calls-2020). Esta convocatoria incluye dos tipos de instrumentos:

  • Acciones de innovación H2020-ECSEL-2020-1-IA-two-stage (ECSEL-IA)
  • Acciones de investigación e innovación H2020-ECSEL-2020-2-RIA-two-stage – (ECSEL-RIA)

 

Además de la financiación directa de ECSEL JU (2020-1-IA 93M€ y 2020-2-RIA 61M€), la Agencia Estatal de Investigación (AEI) y el Ministerio de Asuntos Económicos y Transformación Digital (MINAETD) financian entidades públicas y privadas españolas con presupuestos de 1,3M€ y 10M€ respectivamente.

 

ECSEL JU promueve ECS como tecnologías críticas básicas en un amplísimo rango de áreas y financia proyectos de gran envergadura en lo que se refiere a consorcios y presupuestos. Pueden ver debajo las áreas y objetivos de la convocatoria abierta.

 

Topics and Major Challenges

Transport & Smart Mobility

  • Major Challenge 1: Developing clean, affordable and sustainable propulsion
  • Major Challenge 2: Ensuring secure connected, cooperative and automated mobility and transportation
  • Major Challenge 3: Managing interaction between humans and vehicles
  • Major Challenge 4: Implementing infrastructure and services for smart personal mobility and logistics

 

Health and Wellbeing

  • Moving healthcare from hospitals into our homes and daily life requiring preventive and patient centric care
  • Restructuring healthcare delivery systems, from supply-driven to patient oriented
  • Engaging individuals more actively in their own health and wellbeing
  • Ensuring affordable healthcare for the growing amount of chronic, lifestyle related diseases and an ageing population
  • Developing platforms for wearables/implants, data analytics, artificial intelligence for precision medicine and personalised healthcare and wellbeing
  •  

Energy

  • Major Challenge 1: Ensuring sustainable power generation and energy conversion
  • Major Challenge 2: Achieving efficient community energy management
  • Major Challenge 3: Reducing energy consumption

 

Digital Industry

  • Major Challenge 1: Developing digital twins, simulation models for the evaluation of industrial assets at all factory levels and over system or product life-cycles
  • Major Challenge 2: AI-enabled cognitive, resilient, adaptable manufacturing
  • Major challenge 3: Developing digital platforms, application development frameworks that integrate sensors/actuators and systems
  • Major Challenge 4: Human-centred manufacturing
  • Major Challenge 5: Sustainable manufacturing in a circular economy

Digital Life

  • Major Challenge 1: Ensuring safe and secure spaces
  • Major Challenge 2: Ensuring healthy and comfortable spaces
  • Major Challenge 3: Ensuring anticipating spaces
  • Major Challenge 4: Ensuring sustainable spaces

 

Systems and Components: Architecture, Design and Integration

  • Major Challenge 1: Managing critical, autonomous, cooperating, evolvable systems
  • Major Challenge 2: Managing Complexity
  • Major Challenge 3: Managing Diversity
  • Major Challenge 4: Managing Multiple Constraint
  • Major Challenge 5: Integrating features of various technologies and materials into miniaturised smart components
  • Major Challenge 6: Effectively integrating modules for highly demanding environments
  • Major Challenge 7: Increasing compactness and capabilities by functional and physical systems integration

 

Connectivity and Interoperability

  • Major Challenge 1: Strengthening the EU position on differentiated technologies and enabling it to capture higher value by moving to system/module level
  • Major Challenge 2: Autonomous interoperability translation for communication protocol, data encoding, security and information semantics
  • Major Challenge 3: Architectures and reference implementations of interoperable, secure, scalable, smart and evolvable IoT and SoS connectivity

 

Safety, Security and Reliability

  • Major Challenge 1: Safety, security and privacy by design
  • Major Challenge 2: Reliability and Functional Safety
  • Major Challenge 3: Secure, safe and trustable connectivity and infrastructure
  • Major Challenge 4: Privacy, data protection and human interaction
  •  

Computing and Storage

  • Increasing performance at acceptable costs
  • Making computing systems more integrated with the real world
  • Making “intelligent” machines
  • Developing new disruptive technologies

 

Process Technology, Equipment, Materials and Manufacturing for Electronic Components & Systems

  • Major Challenge 1: Develop advanced logic and memory technology for nanoscale integration and application-driven performance
  • Major Challenge 2: Develop Technology for Heterogeneous System-on-Chip (SoC) Integration
  • Major Challenge 3: Develop technology for Advanced Packaging and Heterogeneous System-in-Package (SiP) integration
  • Major Challenge 4: Extend world leadership in Semiconductor Equipment, Materials and Manufacturing solutions

 

Long-term vision

  • New computing paradigms (‘Beyond CMOS’).
  • Process technology, equipment and materials
  • Systems and components: architecture, design and integration
  • Health & wellbeing
  • Energy
  • Digital Industry
  • Transport and smart mobility
  • Connectivity and interoperability
  • Data science and Artificial Intelligence

Para cualquier cuestión, no duden en ponerse en contacto conmigo beatriz.gomez@aei.gob.es.

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